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The development of an effective corporate vision is a necessary issue for corporate performance, and it is a key issue for corporate sustainable development as well. The recognition of questions like “what is the role of corporate vision in corporate performance” is directly related to the attitude and practice of entrepreneurs and managers toward the development of corporate vision as well as the effectiveness of the corporate vision itself. To better answer the questions concerning the role of corporate vision development and effectively guide the practice of corporations, the authors study the pathways and mechanisms by which corporate visions operate to assist businesses in achieving high performance.

The article completes the construction of indicators to measure each dimension of the corporate vision in line with social cognitive theory and analyzes the relationship between corporate vision and corporate performance by combining qualitative comparative analysis (QCA) and necessary condition analysis (NCA) research methods. The article provides insights into the logic of constructing and adjusting corporate visions from a process perspective.

The mechanisms by which corporate visions can be articulated, accepted and transformed within the organization are also the means by which corporate visions can improve corporate performance. In a dynamic environment, the corporate vision setting and acceptance process integrates the requirements of various stakeholders, leading to the adjustment and acceptance of the corporate vision. As a result, the vision has continuous validity in a changing environment. Both start-ups and non-start-ups can benefit from the guidance provided by a strong corporate vision in overcoming a variety of issues and obstacles to produce strong business performance.

This is the first study that shows the relationship between corporate vision and corporate performance from a process perspective. The authors are interested in understanding which characteristics for building a corporate vision are more accepted by organizational members and, in turn, create high corporate performance. The authors also explore the conditions for corporate vision acceptance. This research has positive implications for shedding some light on the mechanisms by which corporate visions improve corporate performance.

The conventional design method relies on a priori knowledge, which limits the rapid and efficient development of electronic packaging structures. The purpose of this study is to propose a hybrid method of data-driven inverse design, which couples adaptive surrogate model technology with optimization algorithm to to enable an efficient and accurate inverse design of electronic packaging structures.

The multisurrogate accumulative local error-based ensemble forward prediction model is proposed to predict the performance properties of the packaging structure. As the forward prediction model is adaptive, it can identify respond to sensitive regions of design space and sample more design points in those regions, getting the trade-off between accuracy and computation resources. In addition, the forward prediction model uses the average ensemble method to mitigate the accuracy degradation caused by poor individual surrogate performance. The Particle Swarm Optimization algorithm is then coupled with the forward prediction model for the inverse design of the electronic packaging structure.

Benchmark testing demonstrated the superior approximate performance of the proposed ensemble model. Two engineering cases have shown that using the proposed method for inverse design has significant computational savings while ensuring design accuracy. In addition, the proposed method is capable of outputting multiple structure parameters according to the expected performance and can design the packaging structure based on its extreme performance.

Because of its data-driven nature, the inverse design method proposed also has potential applications in other scientific fields related to optimization and inverse design.

As academic social Q&A networking websites become more popular, scholars are increasingly using them to meet their information needs by asking academic questions. However, compared with other types of social media, scholars are less active on these sites, resulting in a lower response quantity for some questions. This paper explores the factors that help explain how to ask questions that generate more responses and examines the impact of different disciplines on response quantity.

The study examines 1,968 questions in five disciplines on the academic social Q&A platform ResearchGate Q&A and explores how the linguistic characteristics of these questions affect the number of responses. It uses a range of methods to statistically analyze the relationship between these linguistic characteristics and the number of responses, and conducts comparisons between disciplines.

The findings indicate that some linguistic characteristics, such as sadness, positive emotion and second-person pronouns, have a positive effect on response quantity; conversely, a high level of function words and first-person pronouns has a negative effect. However, the impacts of these linguistic characteristics vary across disciplines.

This study provides support for academic social Q&A platforms to assist scholars in asking richer questions that are likely to generate more answers across disciplines, thereby promoting improved academic communication among scholars.

Surface mount technology (SMT) is widely used and plays an important role in electronic equipment. The purpose of this paper is to reveal the effects of interface cracks on the fatigue life of SMT solder joint under service load and to provide some valuable reference information for improving service reliability of SMT packages.

A 3D geometric model of SMT package is established. The mechanical properties of SMT solder joint under thermal cycling load and random vibration load were solved by 3D finite element analysis. The fatigue life of SMT solder joint under different loads can be calculated by using the modified Coffin–Manson model and high-cycle fatigue model.

The results revealed that cracks at different locations and propagation directions have different effect on the fatigue life of the SMT solder joint. From the location of the cracks, Crack 1 has the most significant impact on the thermal fatigue life of the solder joint. Under the same thermal cycling conditions, its life has decreased by 46.98%, followed by Crack 2, Crack 4 and Crack 3. On the other hand, under the same random vibration load, Crack 4 has the most significant impact on the solder joint fatigue life, reducing its life by 81.39%, followed by Crack 1, Crack 3 and Crack 2. From the crack propagation direction, with the increase of crack depth, the thermal fatigue life of the SMT solder joint decreases sharply at first and then continues to decline almost linearly. The random vibration fatigue life of the solder joint decreases continuously with the increase of crack depth. From the crack depth of 0.01 mm to 0.05 mm, the random vibration fatigue life decreases by 86.75%. When the crack width increases, the thermal and random vibration fatigue life of the solder joint decreases almost linearly.

This paper investigates the effects of interface cracks on the fatigue life and provides useful information on the reliability of SMT packages.

The purpose of this paper is to investigate the effects of minor addition of the rare earth (RE) element cerium, Ce, on the microstructures and creep properties of Sn-Ag-Cu solder alloys.

The pure Sn, Sn-Cu alloy, Sn-Ag alloy and Cu-Ce alloy were used as raw materials. Sn-Ag-Cu alloys with different contents of RE Ce were chosen to compare with Sn-Ag-Cu. The raw materials of Sn, Sn-Cu alloy, Sn-Ag alloy, Cu-Ce alloy were melted in a ceramic crucible, and were melted at 550°C ± 1°C for 40 minutes. To homogenize the solder alloy, mechanical stirring was performed every ten minutes using a glass rod. During the melting, KC1 + LiCI (1.3:1), were used over the surface of liquid solder to prevent oxidation. The melted solder was chill cast into a rod.

It is found that the microstructure exhibits smaller grains and the Ag₃Sn/Cu₆Sn₅ intermetallic compound (IMC) phases are modified in matrix with the addition of Ce. In particular, the addition of 0.03 wt.% Ce to the Sn-Ag-Cu solder can refine the microstructures and decrease the thickness of the IMC layers of Sn-Ag-Cu solder alloys. Meanwhile, thermodynamic analysis showed that these phenomena could be attributed to the reduction of the driving force for Cu-Sn IMC formation due to the addition of Ce. Results calculated using the thermodynamic method are close to the above experimental data. Thus, the optimum content of Ce in Sn-Ag-Cu solder alloys should be about 0.030 percent. Additionally, the effect of Ce on the creep rupture life of Sn-Ag-Cu soldered joints was studied. It was found that the creep rupture life may be increased up to 7.5 times more than that of the original Sn-Ag-Cu alloy, when Ce accounts for 0.030 percent.

This paper usefully investigates the effects of the RE cerium (Ce), on the microstructures and creep properties of Sn-Ag-Cu solder alloys, optimizing the quantity of Ce in the Sn-Ag-Cu solder alloy through a thermodynamic method and by creep-rupture life testing.